Intel Xeon E3-1275V2 E3 1275 V2 3.5 GHz Quad-Core CPU Processor 8M 77W LGA 1155

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Beschreibung

SPECIFICATIONS

Brand Name: Intel

Application: Desktop

Support Chipset Models: Intel B75

Processor Type: Intel Xeon E Series

Default TDP / TDP: 77

Number OF Therads: 8

Support Memory Type: DDR3

Origin: Mainland China

Socket Type: LGA 1155

GPU-built: YES

Cooling system: No

Support Memory Channels: 2

PCIe VERSION: PCIe 2.0

Usage Scenario: others

Chip Process: 22 nanometers

Unlocked: YES

Type: Quad-Core

L3 Cache Capacity: 8

Number of Cores: Quad-Core

Package: No

L2 Cache Capacity: 1

Please read:

Second-hand product.The origin is sent randomly with a one-year warranty.Due to the production process, the surface of the product is not 100% smooth and may be accompanied by scratches.

Intel Xeon E3-1275 v2 specifications

General information

Type

CPU / Microprocessor

Market segment

Server

Family



Model number  ? 


CPU part numbers


  • CM8063701098702 is an OEM/tray microprocessor

  • BX80637E31275V2 is a boxed microprocessor

Frequency ? 

3500 MHz

Maximum turbo frequency

3900 MHz (1 or 2 cores)
3800 MHz (3 cores)
3700 MHz (4 cores)

Bus speed ? 

5 GT/s DMI

Clock multiplier ? 

35

Package

1155-land Flip-Chip Land Grid Array (FCLGA 1155)

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

May 14, 2012

End-of-Life date

Last order date for consumer processors is January 23, 2015
Last shipment date for consumer tray processors is January 8, 2016
Last shipment date for boxed processors is July 10, 2015

Price at introduction

$339 (OEM)
$350 (box)

S-spec numbers

Part number

ES/QS processors

Production processors


QBZK

SR0PA

BX80637E31275V2


+

CM8063701098702

+

+

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Platform

Carlow


Processor core  ? 

Ivy Bridge-H2


Core stepping  ? 

E1 (QBZK, SR0PA)

CPUID

306A9 (SR0PA)

Manufacturing process

0.022 micron High-K metal gate process

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated


Level 1 cache size  ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3


  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

  • AES / Advanced Encryption Standard instructions

  • AVX / Advanced Vector Extensions

  • F16C / 16-bit Floating-Point conversion instructions


  • EM64T / Extended Memory 64 technology / Intel 64  ? 


  • NX / XD / Execute disable bit  ? 


  • VT-x / Virtualization technology  ? 

  • VT-d / Virtualization for directed I/O


  • TBT 2.0 / Turbo Boost technology 2.0  ? 

  • TXT / Trusted Execution technology


  • HT / Hyper-Threading technology  ? 

  • SMEP / Secure Mode Execution Protection

Low power features


  • Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

GPU Type: HD P4000
Microarchitecture: Gen 7
Base frequency (MHz): 650
Maximum frequency (MHz): 1250
The number of supported displays: 3

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes

Other peripherals

  • Direct Media Interface 2.0

  • PCI Express 3.0 interface

Electrical / Thermal parameters

Thermal Design Power ? 

77 Watt


 


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