1/2/3PCS Thermal Paste 5g Thermal Conductive Glue Hot Adhesive Glue For Radiator Cooling Heatsink Plaster Glue For Chips

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East Supplier PlatformArtikelnummer:1005007087548192-1PC-CHINA

Color: 1PC
Preis:
$7.52 $9.40
Aktie:
Auf Lager ( 1647 Einheiten), versandbereit

Beschreibung

SPECIFICATIONS

Brand Name: NoEnName_Null

Hign-concerned Chemical: None

DIY Supplies: Metalworking

Origin: Mainland China

Model Number: Heatsink Plaster

Certification: none

Specifications: 5g (single)

Melting amount: 0 (200°C/24 Hours)

Evaporation: 0.001% (200°C/24 Hours)

Thermal Conductivity: >0.671W/m-K

Impedance: <0.06

Ging Time: 3min (25°C)

Track Strength: 25Kg

Strength of Connected Buildings: 1.5map

Margin Coefficient: >5.1

Scatter Coefficient: <0.005

Shipment: Fast Shipping

Stock: Sufficient

Support Dropshipping: Support Wholesale

Support Fast Shipping: Support Retail

Type1: Chip Adhesive Glue

Type2: VGA Plaster Glue

Type3: Thermal Pads Conductive Heatsink Plaster


1/2/3PCS Thermal Paste 5g Thermal Conductive Glue Hot Adhesive Glue For Radiator Cooling Heatsink Plaster Glue For Chips



1.It has high strength and fast bonding effect, and is suitable for directly attaching various components, LEDs and heat sinks.

2.Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and , good viscosity, short drying time.

3.It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C.

4.It has short surface curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc.

5.Instructions:

1) Extrusion of the product directly during use, rubbing the surface of the adherend, and immediately covering it after use, in case of trial again

2) The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.

3) Recommended thickness: 0.1-0.5mm, the thinner the better.

4) Please use solvent to clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.

6.The package is sealing and the product is covered with a vacuum bag to insulate the air and increase the storage time.


Thermal properties, strong glue adhesion.

Specifications: 5g (single)

Melting amount: 0 (200°C/24 Hours)

Evaporation: 0.001% (200°C/24 Hours)

Thermal Conductivity: >0.671W/m-K

Impedance: <0.06

Ging Time: 3min (25°C)

Track Strength: 25Kg

Strength of Connected Buildings: 1.5map

Margin Coefficient: >5.1

Scatter Coefficient: <0.005


1 x Heatsink Plaster

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